Cross Section And Top View Morphology Of Cu 6 Sn 5 Imcо Zhao et al. investigated the effect of sn grain size on the imc morphology and evolution of cu 6 sn 5 imc phase during solid state reaction of cu sn at 150 °c 21. the results indicate that the. Download scientific diagram | cross section morphology of cu 6 sn 5 imc located at the interface of sn and sn 3.5ag0.5cu cu joint for given values laser power and scan speeds. from publication.
Cross Section Morphology Of Cu 6 Sn 5 Imc Grown At T Download scientific diagram | cross section and top view morphology of cu 6 sn 5 imc located at the interface of sn 3.5ag0.5cu cu joint for p w =50 w and scan rate= 90 mm min. from publication. Simultaneously, the channels also promote the vertical growth of cu 6 sn 5 grains to get a smaller aspect ratio at sn 3.5ag 0.7cu(sac3507) cu interface than sn cu. (2) the growth thickness of imc during the cooling stage follows the rule of h=kt, which is the reaction control mechanism of the cu precipitation interface. (3) the interfacial cu 6. At low temperatures (≤255 °c), only a needle type (cu,ni) 6 sn 5 imc with a hexagonal cross section was formed. on the other hand, the morphology of the (cu,ni) 6 sn 5 imc changed from needle type to dodecahedron type with increasing reflow temperature and time. the morphology of the (cu,ni) 6 sn 5 imc was also affected by cooling condition. The morphology evolution mechanism and dynamics of cu6sn5 intermetallic compound (imc) in cooling stage were studied by using pure sn solder ball with a diameter of 1 mm to react with polycrystalline cu substrate and form cu6sn5. a nearly uniform height of the scallop like imc grains is attained by using high pressurized air to remove excess liquid solder (that is, for acquisition of the imc.
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