Download scientific diagram | eds spectra of a β sn solder matrix sbsn, b (cu, ni)6sn5, c ag3sn and d cu6sn5 corresponding to a–d regions of fig. 1 from publication: microstructure evolution. Eds spectra of a β sn solder matrix sbsn, b (cu, ni)6sn5, c ag3sn and d cu6sn5 corresponding to a–d regions of fig. 1 and energy disperse spectroscopy (eds). then, the differential.
Eds spectra of a β sn solder matrix sbsn, b (cu, ni) 6 sn 5, c ag 3 sn and d cu 6 sn 5 corresponding to a–d regions of fig. 1 figure 3 reveals the solder bulk microstructure of the above joints after aging for 2016 h. However, in sn 3.0ag 0.5cu 0.5 ni nanoparticles composite material, a very stable (cu, ni) sn imc grew at the interface between composite solder and (osp) cu pad in absence of cu3sn imc. The microstructure of the ssc505 solder included a β sn phase, and sbsn and cu 6 sn 5 intermetallic compound (imc) phases distributed in the solder matrix. the addition of ni produced a new (cu 0.7 ,ni 0.3 ) 6 sn 5 imc phase with a mixed morphology comprising hexagonal and flake shaped phases. From the sem image it can be found that these imc phases (mentioned above) with a dark colour (their average size was 5.32 ± 1.83 μm), were relatively uniformly distributed in the solder matrix. the eds spectrum revealed that the weight fraction of ni, cu and sn in the chosen position were 2.69%, 22.75% and 50.9% respectively, this result.
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