The Morphology Of Sac Cuвђ 8zn Interfacial Cu 6 Sn о Abstract: in this paper, the imc (cu 6 sn 5) morphology evolution was observed by using shanghai light source synchrotron radiation (ssrf) and high pressure air technology. comparing with complete reflow experiments, imc growth data during the cooling stage was obtained to study the growth process of typical cu 6 sn 5 grain. Download scientific diagram | the morphology of sac cu interfacial cu 6 sn 5 grain reflowed at 250 °c and aged at 150 °c for different time, a reflowed only; b aged for 24 h; c aged for 120 h; d.
The Morphology Of Sac305 Cu Interfacial Cu6sn5 Grains Reflowed At Assuming δ ≈ 0.05 μm 17, c 1 −c 0 ≈ 0.001 17, c cu −c 2 = 5 11 and d gb = 5.5 × 10 −6 cm 2 s 27, the thickness of interfacial cu 6 sn 5 as a function of reaction time were calculated. For the cu 6 sn 5 imc phase, the sn grain boundaries have a significant effect on the morphology. an impact of sn grain size on the growth kinetics of the imc layers was also found in experiments. The thickness of the cu 6 sn 5 imc layer initially decreases and then increases in accordance with the changes observed in the cu 6 sn 5 imc grain size depicted in fig. 13. by analyzing the data in fig. 14, it can be seen that the thickness and grain size of the interfacial cu 6 sn 5 imc is the smallest in sac105 0.6si 3 n 4 joint. The formation mechanism, morphology evolution and growth kinetic of interfacial (cu,ni) 6 sn 5 imc at both sn (001)cu and sn ni interfaces were discussed in detail. the reflowed method is suggested as a feasible technique to control the morphology and growth rate of (cu,ni) 6 sn 5 grains for chip stacking packaging. 2. experimental.
The Morphology Of Sac305 Cu Interfacial Cu6sn5 Grains Reflowed At The thickness of the cu 6 sn 5 imc layer initially decreases and then increases in accordance with the changes observed in the cu 6 sn 5 imc grain size depicted in fig. 13. by analyzing the data in fig. 14, it can be seen that the thickness and grain size of the interfacial cu 6 sn 5 imc is the smallest in sac105 0.6si 3 n 4 joint. The formation mechanism, morphology evolution and growth kinetic of interfacial (cu,ni) 6 sn 5 imc at both sn (001)cu and sn ni interfaces were discussed in detail. the reflowed method is suggested as a feasible technique to control the morphology and growth rate of (cu,ni) 6 sn 5 grains for chip stacking packaging. 2. experimental. Results show that interfacial ${\text{cu} {6}\text{sn} {5}}$ grains in sn 3.0ag 0.scu (111)cu joints exhibit mainly scallop like morphology. the grain size and thickness of the interfacial imc layer in the joints change non monotonically with decreasing solder ball diameter, and both of them reach the maximum at a solder ball size of ${200 \mu. In addition, the growth of the interfacial cu 6 sn 5 layer at the sac305 paste cu interface is controlled mainly by grain boundary diffusion, while the growth of the interfacial cu 3 sn layer is controlled mainly by bulk diffusion.
The Morphology Of Sac305 Cu Interfacial Cu6sn5 Grains Reflowed At Results show that interfacial ${\text{cu} {6}\text{sn} {5}}$ grains in sn 3.0ag 0.scu (111)cu joints exhibit mainly scallop like morphology. the grain size and thickness of the interfacial imc layer in the joints change non monotonically with decreasing solder ball diameter, and both of them reach the maximum at a solder ball size of ${200 \mu. In addition, the growth of the interfacial cu 6 sn 5 layer at the sac305 paste cu interface is controlled mainly by grain boundary diffusion, while the growth of the interfacial cu 3 sn layer is controlled mainly by bulk diffusion.
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